underfilladhesive1
| Name: |
Epoxy Chip Underfill adhesive
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| Email: |
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| Site/Blog: |
https://www.deepmaterialcn.com/epoxy-based-chip-underfill.html
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| Location: |
Huizhou City, Guangdong，China
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| Default language: |
C
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| Favorite languages: |
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| About: |
DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. https://www.deepmaterialcn.com/epoxy-based-chip-underfill.html
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